In the hot summer, the heat is unbearable ... With the popularity of multi-core CPU+ multi-graphics platform, especially the trend of core opening caused by AMD, chassis heat dissipation has been paid more and more attention. How to disperse the heat emitted by the platform to the outside of the chassis as much as possible in a limited space with the help of the air duct inside the chassis has become a topic of concern to players.
In order to solve this problem, Arthas finally developed this set of chassis partition heat dissipation technology after a lot of experiments and discussions. Let's take a look at Alsace's patented technology-partitioned cooling technology chassis.
The patented partition cooling technology creates a more reasonable air duct flow direction for the interior of the chassis. The baffle of the partition cooling system is set between the graphics card and the North Bridge. The heat generated by the CPU and the upper north bridge is blown out of the chassis through the fans at the top and back of the chassis, while the heat of the graphics card is blown out through the power fan at the bottom and the back of the chassis, so that several heat sources in the chassis can have their own small circulation environment of air inlet and air outlet. Thereby greatly improving the overall heat dissipation effect of the chassis. According to a large number of effective measurements in various environments, the internal temperature of the traditional chassis without this technology is generally 6 or 7 degrees Celsius higher than that of the Alsace chassis with this technology. Please pay special attention to the fact that the temperature difference of 6 degrees and 7 degrees will definitely play a key role in the hardware protection and stability inside the chassis, so please cherish and pay attention to this part of the temperature difference. Let your love machine get rid of the possibility of high fever and instability in the chassis, and truly feel the carefree feeling brought by the game world.
The above picture shows the heat dissipation mode of traditional chassis. From the figure, it is proved that the air duct graphics card and CPU heat source in the traditional chassis interfere with each other and complement each other, which makes the internal temperature of the chassis stay high and will definitely have adverse consequences on the stability of hardware and system. This once again shows that the partitioned cooling box can effectively avoid the heat generated between the CPU and the graphics card from heating each other, and each heat source can work independently without interference. ?
The above picture is a schematic diagram of Alsace chassis without hardware installed.
The above picture shows the schematic diagram of Alsace chassis after hardware installation.
The patent application number of partitioned heat dissipation technology is: 201120121803.4.
The emergence of this technology makes up for the blank of heat dissipation solution that has plagued gamers for many years, and makes the heat dissipation problem of the chassis be solved simply and effectively. Its appearance has enabled Alsace to lead the industry in another technological update, indicating that Alsace's supreme position has been consolidated and strengthened. Thank you! ~