What is the concept of patented partitioned heat dissipation technology?

The patented partition cooling technology creates a more reasonable air duct flow direction for the interior of the chassis. The baffle of the partition cooling system is set between the graphics card and the North Bridge. The heat generated by the CPU and the upper north bridge is blown out of the chassis through the fans at the top and back of the chassis, while the heat of the graphics card is blown out through the power fan at the bottom and the back of the chassis, so that several heat sources in the chassis can have their own small circulation environment of air inlet and air outlet. Thereby greatly improving the overall heat dissipation effect of the chassis.