Electronic devices usually include a device body and a backplane structure. There are CPU and other functional parts in the equipment, which will keep heating up during operation. When the temperature is too high, it will seriously affect the operation of functional components themselves, leading to the jamming of electronic equipment.
Therefore, in order to solve the problem of mobile phone fever, Xiaomi applied for an invention patent named "Backplane Structure of Electronic Equipment and Electronic Equipment" as early as February 3, 2006. The applicant is Xiaomi technology co., ltd.
As shown in the above figure, the two heat conduction holes symmetrically arranged on the left and right sides of the heat source can intercept the heat emitted by the heat source in the left and right directions as much as possible, and conduct the heat to the areas not covered by the ideal isotherm, such as the upper left corner, the upper right corner and the lower half of the backboard structure, so as to minimize the temperature difference of the whole backboard structure at various positions, without causing the ultra-high temperature phenomenon of local hot hands, which is helpful to improve the user experience.
Xiaomi mobile phone used to be synonymous with enthusiasts, and it is also a hand warmer in winter. After the innovative design of the external structure of the mobile phone, the heat generated by the mobile phone can be reasonably dissipated, thus achieving the purpose of cooling the mobile phone. Do you think the fever problem of Xiaomi's mobile phone is serious? Welcome to discuss in the comments section.
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