The two-step method is low cost.
The production process of PET copper foil is divided into one-step method (chemical deposition method/vacuum magnetron sputtering method/vacuum evaporation method), two-step method (vacuum magnetron sputtering hydroelectron microscope) and three-step method ( Vacuum magnetron measurement, vacuum evaporation, water plating). The cost of one-step sputtering plating is higher, while the three-step method has higher deposition efficiency but lower yield. Therefore, mainstream manufacturers currently use the two-step method.
Two-step method: first magnetron sputtering the copper layer on PET/PP, and then water electroplating to thicken it. This method can meet technical indicators such as staining, perforation, and ductility. Among them, the second major process, ion replacement, has technical similarities with traditional electroplating methods, and the technology is relatively mature. PVD sputtering coating has become a current technical difficulty and the core technical obstacle to the commercialization of PET copper foil.