The company's main products are low VF Schottky, VDMOS, IGBT, PWM integrated circuit, LED constant current drive circuit and so on. Compared with similar chips, the chips produced by the company have the advantages of more optimized structural design, strong durability and reliability, thin device thickness, low power consumption and low cost. Widely used in refrigerators, air conditioners, automobiles, digital cameras, smart cards, mobile phones, air conditioners, DVD players, MP3, MP4, mobile phones and related communication products, as well as other information, home appliances and consumer electronic equipment products.
The company has developed high-voltage power device junction terminal processing technology, large-area high-uniformity high-quality gate oxide manufacturing technology, etching technology, ion implantation technology and diffusion technology. Through structural optimization and innovative structural and production process design, the performance is improved, and the voltage, current and frequency are converted into the values required by the load. The performance is stable, it is more resistant to voltage than the traditional chip, and the V(f) value is very low. Under the design of high current and high voltage, the switching speed can be improved, the durability and reliability can be further enhanced, the device thickness can be reduced, the power consumption can be reduced, the electric energy can be better utilized, the transmission, conversion and * * * control of electric energy can be realized, and the industrial production efficiency can be greatly improved. Relying on imported advanced foreign equipment and technology, the products have broad market prospects at home and abroad.
The company introduced R&D team from Taiwan Province Province, and the average working experience of core members is over 20 years. At present, there are 45 professional technicians, and more than 80% of R&D personnel have senior titles. Many of them have undertaken scientific research projects such as 863, 973 and the national science and technology support plan. The project has applied for 8 invention patents (4 authorized) and authorized 23 utility model patents. Established cooperative relations with Xi Jiaotong University and University of Electronic Science and Technology of China in Industry-University-Research.
The project has independent intellectual property rights, high-tech products and good industrial layout. At the same time, the supporting epitaxial wafer manufacturing enterprises under construction have formed a strong complementary promotion. After the project is put into production, it has a very obvious promotion and promotion effect on improving the technical content of domestic chips, reducing dependence on foreign products, improving national information security and driving the electronic industry in Sichuan and surrounding areas.
Legal Representative: Cui Yongming.
Date of establishment: 20 14-03-05
Registered capital: 255,507,800 yuan.
Location: Sichuan Province
Unified social credit code: 91510900092971364y.
Business status: surviving (in business, in business, on record)
Industry: manufacturing industry
Company type: joint stock limited company (unlisted, invested or controlled by natural persons)
Staff size: 500-999 people.
Enterprise Address:No. Xiangshan West Road 188, Suining Economic and Technological Development Zone, Sichuan Province
Business scope: design, research and development, manufacturing, sales and technical consulting services of semiconductor components; Import and export business; Import and export business of electronic products and technologies. (Projects subject to approval according to law can only be operated after approval by relevant departments)