Huang invention patent

1. Huang, Pan Jianling, Qing, Wang Lai, a cyanide-free gold-tin alloy electroplating solution by * * deposition electroplating method, with the invention patent application number of 2009 10 187274.5.

2. Huang, Yu Daquan, Wang Lai, Sn-Zn-based lead-free solder alloy containing rare earth elements, China invention patent authorization number ZL02 109623.6, authorization announcement date1KLOC-0/7,2004.

3. A SnZn series lead-free solder flux and its preparation method. The invention patent number of China is ZL2007 100114.4, and the date of authorization announcement is 065438+200910.