How many kinds of sockets are there for CPU?

To talk about the interface architecture of CPU, we must first understand the composition of CPU. A central processing unit includes a substrate, an inner core and a filler between the inner core and the substrate. The substrate is the circuit board bearing the CPU core, which is responsible for all communication between the core chip and the outside world, determining the clock frequency of the CPU, the capacitors and resistors on it, and the circuit bridge that determines the clock frequency of the CPU. On the back or lower edge of the substrate, there are pins or card interfaces for connecting with the motherboard. Duron now uses a ceramic circuit board, which has been used since the Pentium era. Now some CPUs use organic materials instead of ceramics. The chip whose CPU core is made of monocrystalline silicon can be said to be the brain of the computer, where all calculations, receiving/storing commands and processing data are carried out. After the CPU core is turned over, it is packaged on the ceramic circuit substrate, which has the advantage that the CPU core can directly contact the heat sink. And the other side of the CPU core should be connected with external circuits. Today's CPU has tens of millions of transistors, all connected to external circuits. The connection method is to weld a wire on every few transistors and connect it to the external circuit. Because all calculations are carried out on a small chip, the CPU core will emit a lot of heat, and the heat dissipation of CPU is very important; The core and the filler between the core and the substrate are used to relieve the pressure from the radiator and fix the chip and the circuit substrate. Because it connects two aspects with large temperature difference, it must be very stable, and its quality sometimes directly affects the quality of the whole CPU.

1, CPU package

The most common package of CPU is PGA (Pin Grid Array) package, which is usually square or rectangular. Three, four or more rows of pins are evenly distributed around the edge of the CPU, and the pins can be inserted into the corresponding sockets on the CPU sockets of the motherboard, thus realizing the connection with the motherboard. With the increase of CPU bus bandwidth and the enhancement of CPU function, the number of CPU pins is also increasing, and the requirements for heat dissipation and various electrical characteristics are higher, which leads to the evolution of packaging methods such as SPGA (staggered pin grid array) and PPGA (plastic pin grid array). Some products of PentiumⅲⅲCoppermine CPU and AMD Company adopt unique FC-PGA (Flip Chip Pin Grid Array) packaging technology. The core is turned 180 degrees under the packaging substrate and firmly seated on the packaging substrate, which can shorten the connection and is beneficial to heat dissipation.

Encapsulation can isolate CPU from air and avoid dust. Good packaging helps the CPU chip to dissipate heat.

Intel's future bump-free multilayer packaging technology-BBUL technology will completely change the face of CPU packaging. The advantage of BBUL technology is that the silicon chip is completely integrated into the CPU. The circuit substrate of the CPU packaged by BBUL is only one layer, and the silicon chip is directly packaged on the circuit substrate, which can reduce many solder joints. Another advantage of BBUL is that it can avoid crushing the core when installing the radiator. BBUL can also make the distance between the core and the capacitor closer, make the CPU more stable, and be thinner and smaller than the traditional CPU. Another advantage of BBUL package is to manufacture multi-core CPU.

2. Central processor interface

The interface of CPU is generally pin interface, which is called Socket. The CPU with socket interface has hundreds of pins inserted into the pinhole of the CPU socket of the motherboard one to one. The interface of the CPU and the socket of the motherboard must be exactly the same, otherwise the CPU cannot be used. There are several types of CPU interfaces.

Socket 4: Support Intel 60mhz-66mhz p5t series cpu.

Socket 5: supports Intel 75mhz-166mhz p54c/p54cs series cpu.

Socket 6: Intel 80486 dx4/ Pentium series cpu.

Socket 7: supports Intel P54C/P54C/P55C series cpu from 75 MHz to 200 MHz, and supports AMD k5/k6-2/k6-3.

Socket 8: supports Intel150mhz-200mhz pentuim pro series cpu.

Slot 1: The technical structure of slot 1+0 interface is advanced, which can provide greater internal transmission bandwidth and CPU performance. With the popularity of Socket 370 motherboards, the sales of SLOT 1 motherboards are not as good as before.

Slot 2: Slot 2 is for professional use: a system serving high-end servers and graphics workstations. The CPU used is also expensive Xeon series. Motherboard with slot 2 interface has more than two CPU slots for multiple processors to work at the same time.

SLOT A :SLOT A Interface Technically and performance, SLOT A motherboard is fully compatible with all kinds of original peripheral expansion card devices. It uses digital company's Alpha bus protocol EV6. EV6 architecture is the most advanced architecture at present, which adopts multi-thread point-to-point topology and supports 200MHz bus frequency, laying a good speed foundation for K7. In order to reduce the manufacturing cost and CPU design and production cycle, AMD has developed the latest Socket A series motherboards, which adopt 462-pin interface design and support the latest new Athlon and Duron CPU.

Socket A:Socket A is AMD's powerful weapon against Intel now, and AMD has consolidated their position in the market with the latest products. Although AMD has a small share in the CPU market, it has won the army of Intel with its K7 family processors.

Speed 7: Speed 7 interface directly supports 100MHz bus frequency and AGP graphics acceleration port, which prolongs the life of Socket 7 interface motherboard.

Socket 370 :Socket 370 is an interface provided by Intel for Celeron A CPU. Since then, Intel has been constantly changing its strategy. In the new millennium, with the introduction of new P Ⅲ and Celeron Ⅱ of Intel Coppermine series CPU (both designed with Socket 370 structure), the motherboard with Socket 370 interface changed its low-end image and gradually became the mainstream of CPU interface structure motherboard.

Socket423: The early Pentium 4 series processors were encapsulated in Socket 423.

Socket478: Pentium 4 processor based on Northwood core must be packaged in Socket 478 and processed by 0. 13 micron process.