A double-layer flexible double-sided copper clad laminate comprises an upper copper foil layer and a lower copper foil layer, and a three-layer structure base material layer arranged between the upper copper foil layer and the lower copper foil layer, wherein the three structural materials of the base material layer are all polyimide resin, and the base material layer comprises a thermoplastic polyimide resin layer, a thermosetting polyimide resin layer and a thermosetting polyamic acid layer. Thermoplastic polyimide mixed coating, thermosetting polyamic acid? The thermoplastic polyimide mixed coating is arranged on one of the thermoplastic polyimide resin layer and the thermosetting polyimide resin layer. Compared with the thermoplastic polyimide resin layer and thermosetting polyimide resin layer, the thermoplastic polyimide mixed coating has a lower thermal expansion coefficient, and the expansion degree of the obtained copper-clad plate product after heating is very small, which solves the phenomenon that the existing copper-clad plate expands greatly due to the large expansion coefficient, avoids affecting the operation of related electronic products, and has a more stable structure.
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