A belt-shaped heat transfer piece is connected between the heating chip inside the mobile phone and the earphone socket, and the belt-shaped heat transfer piece has certain insulation, or an insulation layer is arranged between the belt-shaped heat transfer piece and the earphone socket; There is also an external radiator.
The radiator is provided with an earphone male metal heat transfer piece matched with the earphone mother seat, and the metal heat transfer piece is connected with a hollow radiator metal piece. The patented technology of the invention makes full use of the external interface and external radiator of the mobile phone, and provides a new heat dissipation mode for the internal heating chip of the mobile phone, especially the CPU chip.
A belt-shaped heat transfer piece is connected between the heating chip inside the mobile phone and the earphone socket, and the belt-shaped heat transfer piece has certain insulation, or an insulation layer is arranged between the belt-shaped heat transfer piece and the earphone socket; An external radiator is also arranged, and the radiator is provided with an earphone pin-shaped metal heat transfer piece matched with the earphone mother seat, and the metal heat transfer piece is connected with a hollow heat dissipation metal piece.
Basic information
The original silicone grease on the mobile phone chip was replaced by mx-4 silicone grease with better thermal conductivity.
The Xiaolong 808 processor is on the back, and this side is the power supply, and chips such as RF will also heat up.