The differences are as follows
ABF carrier boards are mainly used for high computing performance ICs such as CPUs, GPUs, FPGAs, and ASICs. ABF substrate matches the advanced semiconductor manufacturing process to meet its requirements for fine lines and thin line widths. At present, ABF carrier board has become the standard configuration of FC-BGA packaging. High-performance computing applications and chips such as PCs and processors all have demands for FC-BGA packaging. It is reported that Apple’s self-developed M1 chip uses FC-BGA packaging, and its ABF carrier board is supplied by Samsung Electro-Mechanics.
IC carrier board is an important material used in IC packaging to connect the chip and the PCB motherboard. Its main functions include providing protection, fixed support and heat dissipation for the chip. From the perspective of packaging material cost, the cost of high-end flip-chip IC carrier boards accounts for as high as 70 to 80%, making it the material with the highest value in the packaging process.