Low-temperature vinyl glue is a one-component epoxy glue and a low-temperature heat-curing modified epoxy resin adhesive. It is used for low-temperature curing and can form optimal adhesion between various materials in a very short time. Relay, the product has excellent working performance, high storage stability, and is suitable for memory cards, CCD/CMOS and other devices. Especially suitable for heat-sensitive components that require low-temperature curing. It has the characteristics of rapid curing at ultra-low temperature, excellent bonding performance, and strong impact resistance.
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