Boss, that's a little big. Most manufacturers in pcb industry will have this problem. There is no good solution. That is, increase the blowing rate, maintain the uniformity of electroplating solution, and increase the swing times of electroplating plate. This is basically caused by electroplating processing. There is no way to completely eliminate it. It can only be said that we need to find a manufacturer to keep the electroplating uniformity within a certain range, and our factory is 90% (excluding the edge of the plate). Because it is caused by electroplating solution processing technology, it is basically impossible to completely eliminate it. Unless plated or otherwise treated. It seems that there is an ultrasonic electroplating method, which can be controlled above 95%. Of course, you have to have equipment and money ~
If the landlord succeeds in what no one in the world has done. You can apply for a patent. . . . . .