Heat-conductive silicone coating skills: avoid CPU tightness or pin insulation problems.

The use of heat conductive silica gel is similar to that of silicone grease, but special attention should be paid to it. In this paper, the application method of thermal conductive silica gel will be introduced in detail to help readers better understand this process.

Pay special attention when using it for the first time.

When it is used for the first time, the thermal conductive silica gel will melt at the high temperature of the CPU, and the CPU and the heat sink will be evenly bonded. Therefore, it is necessary to apply it properly to avoid the problem of tight insulation of CPU or pin due to the high-temperature melting silica gel flowing into CPU slot.

The difference between silica gel and silicone grease

In contrast, silicone grease adhesion is easier to remove. Silicone adhesive is more difficult to remove and often needs to be cut with a knife. Considering the robustness of CPU ceramics, it can be realized by careful operation. This is also the reason why the all-purpose adhesive is rarely used as heat-conducting silica gel, because its adhesion is too firm and it is difficult to separate.