At the beginning of the 20th century, in order to simplify the manufacture of electronic machines, reduce the wiring between electronic parts and reduce the manufacturing cost, people began to study the method of replacing wiring with printing. In the past 30 years, engineers have continuously proposed to use metal conductors as wiring on insulating substrates. The most successful thing is that in 1925, Charles Ducas of the United States printed a circuit pattern on an insulating substrate, and then successfully established a conductor for wiring by electroplating.
Until 1936, Austrian Paul isler published the foil technology in Britain, and he used the printed circuit board in a radio device. In Japan, Shigeru Miyamoto's assistant successfully applied for a patent (patent number 1 19384) by spraying the wiring method "メタリコンンンンン". Among the two methods, Paul This practice is called subtraction, which removes unnecessary metals. The method of Charles Ducas and Hayashi Miyamoto is to add only the required wiring, which is called the addition process. Even so, due to the high calorific value of electronic parts at that time, it was difficult to use the substrates of the two together, so there was no formal practical work, but it also made the printed circuit technology further. In recent ten years, China's printed circuit board (PCB) manufacturing industry has developed rapidly, with the total output value and output ranking first in the world. Due to the rapid development of electronic products, the price war has changed the structure of the supply chain. China has the advantages of industrial layout, cost and market, and has become the most important PCB production base in the world.
Printed circuit boards have developed from single-layer to double-board, multi-layer and flexible board, and are constantly developing in the direction of high precision, high density and high reliability. Constantly shrinking the volume, reducing the cost and improving the performance make the printed circuit board still maintain a strong vitality in the future development of electronic products. The future development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, fine wire, small spacing, high reliability, multi-layer, high-speed transmission, light weight and thin thickness.