The semiconductor valve consists of a plurality of semiconductor elements and a plurality of liquid coolers connected in series. Semiconductor elements and coolers are arranged in a stacked manner, and each semiconductor element is placed between two coolers. The valve has a pressure device to generate pressure acting in the axial direction of the stacked structure. The valve has a voltage divider connected in parallel with each semiconductor element. The voltage divider consists of resistors.
Semiconductor valves have been known before. For example, Swedish patent application 334,947 introduces such a valve (corresponding to U.S. Pat. No.3,536, 133). This kind of valve is also used by people, for example, in the rectifier to transmit electric energy through high voltage DC; Or as a component of switching equipment, used for static reactive power compensation, etc.
Semiconductor valves should use a series of voltage dividers and semiconductor components at the same time, and each semiconductor component should be connected in parallel with a voltage divider. Each such voltage divider typically contains one or more resistors. Valves equipped with such a voltage divider have also been known before, such as those described in U.S. Pat. No.3,794,908 and No.4,360,864. The energy loss of the voltage divider is very high, usually reaching the order of several hundred watts. If the resistor is air-cooled, there are several serious disadvantages. Resistors must be equipped with cooling flanges or similar cooling components. In order to ensure that the resistor can fully radiate heat into the surrounding air without the temperature rising too high, the size of the resistor must be made relatively large. In addition, in order to remove the released heat, it is necessary to ensure that there is enough cooling air flowing through the resistor.
For these reasons, if the semiconductor valve uses air-cooled resistors, its volume will become relatively large. Another disadvantage of this kind of resistor is that the heat released by the resistor is very high, which will also raise the temperature of the valve and room. If some cooling measures are not specially added, the working temperature of other indoor components and equipment will increase.
It has been known before that the manufacture of semiconductor valves is liquid-cooled high-power resistors. For example, the United States patent. 227438 1 introduces this kind of resistance. However, manufacturing a large number of such liquid-cooled voltage divider resistors one after another in a semiconductor valve will make the valve very complicated and require many joints and pipes to circulate the coolant. The valve will still be relatively large, and the temperature of the valve and the room will still be raised by the heat emitted by the resistor and the coolant pipe.
Semiconductor valve installs a voltage divider resistor on a cooling rod to cool the semiconductor components of the valve. This technology has been known before, and U.S. Pat. No.4,654,38+078,630 introduced this technology. Part of the heat emitted by the resistor will be absorbed by the coolant flowing through the cooling rod. But the heat dissipated into the surrounding air is still relatively high.
It is an object of the present invention to manufacture a simple and compact valve as mentioned at the beginning, so as to minimize the heat dissipated into the surrounding air by the resistor of the voltage divider.
Improved embodiment of semiconductor valve cooler. Fig. 4 shows an embodiment in which the resistor is mounted on a separate block. Fig. 5 shows an example of applying resistance in a special passage of a cooler. An example of a semiconductor valve according to the present invention is shown, and these figures are views obtained by observing the valve from two mutually perpendicular directions, both of which are perpendicular to the longitudinal axis of the valve. The valve has six semiconductor elements 1-6, which can be semiconductor switching elements or diodes. By design, semiconductor components can withstand pressure contact and double cooling, that is, these components must withstand the pressure between two coolers installed on both sides of each component. For example, the cooler and the semiconductor element are tightly pressed together with a force of10,000 or tens of thousands of newtons to form a stacked arrangement. This tight compression makes the whole stack firm and safe, and also maintains the necessary good electrical contact and thermal contact between each semiconductor element and the cooler.