Tianji 1000L(MT6885Z)
Manufacturing process: TSMC 7nm process is adopted.
Number of cores: 4 A77 cores at 2.2GHz +4 A55 cores at 2.0GHz.
GPU: Mali-G77 MC7 695MHz .
The maximum supported ROM and RAM specifications are UFS2. 1 and lpddr4x (1866mhz 4 *16 bits).
Performance: Geekbench5 scored 675 points for single core and 2700 points for multi-core. Compared with Kirin 985, the single-core performance is at the same level. Multi-core performance is slightly higher than Kirin 985 and slightly lower than Snapdragon 855.
Realization of 5G mode: integrating 5G baseband (supporting 5G dual card dual standby)
Tianji 820
Manufacturing process: TSMC 7nm process is adopted.
Number of cores: 4 A76 cores at 2.6GHz +4 A55 cores at 2.0GHz.
GPU: Mali-G57 MC5 900MHz .
ROM and RAM specifications are supported at most: UFS2. 1 and lpddr4x (2133mhz 2 *16 bits).
Performance: Geekbench5 single-core 600 points, multi-core 1800 points. By horizontal comparison, single-core performance is at the same level as multi-core performance Kirin 820 and Snapdragon 765G.
Realization of 5G mode: integrating 5G baseband (supporting 5G dual card dual standby)
Midrange chip
Tianji 800U
Manufacturing process: TSMC 7 nm process manufacturing.
Number of cores: 2 A76 cores at 2.4GHz +6 A55 cores at 2.0GHz.
GPU: Mali-G57 MC3 950MHz .
Maximum supported ROM and RAM specifications: UFS2.2 and LPDDR 4X (2133mhz 2 *16 bits).
Performance: Geekbench5 single-core 600 points, multi-core 1800 points. Horizontal comparison, horizontal comparison, single-core performance is at the same level as multi-core performance Kirin 8 10 and Snapdragon 765G. In vertical comparison, CPU performance is basically the same as that of Tianji 820. Compared with Tianji 800U, the improvement of Tianji 820 is mainly in GPU, and the improvement range is about 40%.
Realize 5G mode: integrate 5G baseband (support 5G dual card dual standby).
Tianji 800
Manufacturing process: TSMC 7 nm process manufacturing.
Number of cores: 4 A76 cores at 2.0GHz +4 A55 cores at 2.0GHz.
GPU: Mali -G57 MC4 748 MHz.
The maximum supported ROM and RAM specifications are UFS2. 1 and lpddr4x (2133mhz 2 *16 bits).
Performance: Geekbench5 single-core score 520, multi-core score 2 180. In transverse comparison, the performance of single core is slightly lower than that of Kirin 810; Multi-core performance is slightly higher than Snapdragon 768G and slightly lower than Snapdragon 845.
Realize 5G mode: integrate 5G baseband (support 5G dual card dual standby).
Low end chip
Tianji 720
Manufacturing process: TSMC 7 nm process manufacturing.
Number of cores: 2 A76 cores at 2.0GHz +6 A55 cores at 2.0GHz.
GPU: Mali-G57 MC3 .
Maximum supported ROM and RAM specifications: UFS2.2 and LPDDR 4X (2133mhz 2 *16 bits).
Performance: Geekbench5 single-core score 5 15, multi-core score 1650. Lateral comparison shows that the single-core performance is basically the same as that of Snapdragon 730G. Multi-core performance is at the same level as Xiaolong 835 and Kirin 970.
Realize 5G mode: integrate 5G baseband (support 5G dual card dual standby).