Huawei superposition packaging technology patent

On February 4th, 65438, yesterday, Huawei Technologies Co., Ltd. disclosed the patent of "a display panel packaging structure" with the publication number of CN2 15008275U.

The patent abstract shows that the embodiment of the application provides a display panel packaging structure. IT House understands that the packaging structure of the display panel includes:

ILD, an interlayer dielectric layer and a metal trace arranged on the interlayer dielectric layer, wherein the metal trace consists of a plurality of metal layers with different etching selectivity, and the metal trace extends outward from the effective display area AA of the display panel to the edge of the display panel;

An anode metal layer is arranged on the surface of the metal wiring, which covers at least one target metal layer of the metal wiring to prevent the anode etching solution from etching the target metal layer laterally, so that a water-oxygen channel is not formed on the aluminum-based material, the water-air-oxygen channel outside the display panel is prevented from entering the effective display area of the display panel, and the problem of black spots of the display panel is solved.