The chip substrate determines the epitaxial materials and subsequent processes. At present, sapphire substrate, silicon carbide substrate and silicon substrate are relatively mature. Silicon carbide substrate is a patent of CREE company in the United States. Sapphire substrate is widely used, but the equipment and technology are also in the hands of foreign investors. Only LED with silicon substrate has independent intellectual property rights in China, and it is also developed and produced in Nanchang at present, but it can only be mass-produced on a small chip scale.
LED lamp bead or module package
Mainly production equipment and heat conducting materials. All kinds of dispensing, crystal fixing, threading, pouring and sorting equipment; Thermal grease, silver paste, phosphor powder, packaging material, etc. They are all imported from abroad and are constantly being copied and improved at home.
Assembly of LED lamp
The downstream industry of LED belongs to the semi-traditional technical field, which is suitable for the development of China. Switching power supply, LED driver IC and aluminum alloy die casting technology are the key points. These are all developed by the people themselves and supported by government policies.
The research and development of LED upstream and downstream and application materials such as high thermal conductivity aluminum substrate, ceramic heat dissipation material and high thermal conductivity low expansion coefficient patch substrate have considerable development space in China. These materials are helpful to improve the chip size and luminous efficiency of high-power LED. At present, the state has not paid enough attention to this aspect, which is worth reviewing compared with the large subsidies for imported MOCVD production equipment. These R&D don't need a lot of investment, but the return period is long. The state should actively designate academic institutions to cooperate with related industries and give greater incentives.