Shenzhen huifengyuan information consulting co., ltd
In today's PCBA assembly with reflow soldering technology as the main technology, the application of solder paste is an indispensable work. Because solder paste itself is a complex viscous material with rheological properties, solder paste printing is considered to be the most problematic part in the whole SMT assembly technology. In SMT industry, the information provided by most large users shows that the process problems caused by solder paste printing account for more than 60% of all problems.
Solder paste printing is a leading technology, and the problems it brings sometimes only appear in reflow soldering. Such as solder balls, monuments and other failures. If you don't understand the reason, you don't have enough control over the solder paste printing process. It may be misunderstood as a problem caused by other processes, which is difficult to solve. Solder paste is also a process that requires careful work. For example, if the material and manufacturing technology of scraper and steel mesh are not well integrated into the whole process, it will often bring high difficulty to the quality control of the process. To do a good job in the whole solder paste printing process, users must first know the truth of all these details. So as to decide what to control and how to control it.
Suitable participants: it is recommended that process and equipment technical managers, process engineers, equipment engineers in charge of printing machines, auxiliary materials engineers in charge of selection and testing of solder paste auxiliary materials, and quality engineers in charge of quality control attend; In addition, technicians from solder paste printing equipment, tools and solder paste suppliers are also suitable to participate.
Features of technical lecture: This lecture was specially designed by Mr. Xue Jingcheng from Singapore invited by Shenzhen Huifengyuan Information Consulting Co., Ltd. for technicians and grass-roots managers of solder paste printing process users. The course comprehensively and deeply discusses the principle and application of various important process characteristic parameters in solder paste printing, as well as various corresponding printing faults. In addition to the basic and commonly used technologies, this course also introduces the latest advanced technology of solder paste printing, so that students can have a deeper understanding.
Technical lecture outline:
The first lecture: general theory of solder paste printing;
This lecture starts with the original technology of solder paste printing, and introduces the types and application scope of various solder paste addition technologies as a whole. The positioning and horizontal state of solder paste printing technology at present are pointed out. And how to treat and use this technology as a whole. The main contents include:
The whole form of solder paste printing;
Various technologies of solder paste application;
From screen printing to wire mesh printing;
Technical problems of solder paste printing;
Definition and quality evaluation elements of good solder paste printing;
Principle and integrated application of solder paste printing system.
Lecture 2: Solder paste technology
Good solder paste printing requires a good grasp of the characteristics of solder paste materials. Because the formula of solder paste needs to take care of various technical requirements and storage problems, the formula content is varied and the proportion control is complicated. And the results it brings to users are different performances, each with its own advantages. Understanding the characteristics of solder paste is one of the key jobs in printing. This lecture will share with users the basic and various important characteristics of solder paste and its influence on process quality. Help customers better choose and control their use. The main contents of this lecture are:
The function and technical requirements of solder paste;
Composition of solder paste;
The shape of solder paste metal particles;
Influence of solder paste metal particle size on process;
Viscosity of solder paste;
Other characteristic parameters and supplier indicators of solder paste;
Trouble with solder paste;
Packaging and management of solder paste.
Lecture 3: Solder Paste Printing Process
This lecture looks at solder paste printing technology from a technical point of view. Including the conditions and preparations before printing, the principles and concerns of various technological processes in the printing process, and the points that need attention and control in operation and application. In the case of good design and quality of printing machine, solder paste and steel screen, if the key parameters of printing cannot be set correctly and adjusted properly, the printing quality can still not be guaranteed. Therefore, this lecture will share with users the technical and management points that need to be understood and paid attention to in the process. The contents of this lecture include:
A prerequisite for a good solder paste printing process;
Examples of poor preconditions;
Preparation of printing process;
Four steps and functions of printing;
PCB identification, positioning and support technology and settings;
Design considerations of PCB reference points for printing;
The principle and elements of solder paste filling in printing;
Consideration of solder paste leveling;
Technical points of tin removal;
Clean technology;
Characteristic parameters of printing process.
Preparation and execution steps of printing process;
Lecture 4: scraper technology
This lecture explains a key feature of solder paste printing technology-"scraper". Students can learn about different types of scrapers in the industry and their performance differences. At the same time, we also know what important characteristics the scraper needs and their functions in the process. The contents of this lecture include:
Type and function difference of scraper;
Development of scraper;
Important characteristics of scraper (angle, hardness, size, etc. );
Influence of various scraper characteristics on machining quality;
Material and performance of scraper;
Problems and countermeasures of scraper;
Advanced scraper technology;
Closed scraper.
Lecture 5: Steel Mesh Technology
This lecture explains another key feature of solder paste printing technology-"steel mesh". Steel mesh is one of the key factors to determine the reliability of PCBA after assembly. Therefore, to master the solder paste printing technology, the understanding of steel mesh must be in place. The main contents of this lecture include the following points:
Function and performance of steel mesh
Types and development of steel mesh
Five factors determining the quality of steel mesh
Steel mesh material
Consideration of the thickness of steel mesh
Steel mesh opening size
Shape consideration of openings in steel mesh
Relationship between artificial technology and quality of steel mesh
Other considerations for steel mesh
Ladder steel mesh and open steel mesh
Lecture 6: Failure Mode and Principle of Solder Paste Printing
This lecture explains the phenomenon and principle of solder paste printing and how to deal with nearly 30 possible failure modes. With the knowledge of the above six lectures, students can solve these similar problems in their work after understanding them. The main contents of this lecture are:
Summary of Definition of Solder Paste Printing Quality
Review the prerequisites and problem cases of printing quality
Failure modes and principles of 20 printing processes
Possible faults after printing
Lecture 7: Introduction of New Technology of Solder Paste Application
Injection technology used in solder paste has a long history. But there have always been some unsatisfactory places. The most important thing is to control the fineness and application speed of solder paste. In recent years, the industry has developed new solder paste application technology and equipment similar to inkjet printer technology. Traditional injection technology has been upgraded to a higher level. This lecture introduced some concepts and values of this new technology to students.
The main contents are:
Problems in Printing and Injection of Solder Paste
Principle of solder paste injection technology
Advantages and limitations of solder paste spraying technology
Possible role of solder paste spraying
Lecture time: July 4-5, 20 13 (Shenzhen)/July16-/kloc-0 /7 (Suzhou)
Lecture fee: 2,500 yuan/person (15% discount for groups of four or more, 15% discount for VIP members of HSBC and 15% discount for SIP members).
Contact: Amy Wang Tel: 0755-26563250
Mobile phone: 15999637249 Email: Wang Baichun1982 @126.com.
Introduction to Xue Jingcheng:
Mr. Xue Jingcheng: Engaged in electronic industry for 3 1 year. He has held important technical and management positions in internationally renowned electronic enterprises such as Philips in the Netherlands, Hewlett-Packard in the United States, Maituo in Japan and Panasonic. During his tenure, he was engaged in process technology development and transfer, equipment research and development, production technology management, quality technology and market support. During his tenure, he was sent to study in parent companies such as the United States, Japan and the Netherlands, specializing in advanced technology and management knowledge. And help to transfer and promote to subsidiaries and customers in the Asia-Pacific region. Participated in 13 countries and regions and assisted more than 70 factories (before 2006). He has rich knowledge and practical experience in the application of technology, the design of management system and the integration of the two. In years of theoretical research and practice, some applied technologies have also been created. Such as "dynamic quality management method", "production mode configuration optimization method" and "lean trial production" and so on. Since 1999, Mr. Xue Jingcheng has been active in SMT industry in China, helping users to improve their manufacturing and management technology. At the same time, I am very familiar with the management and technical status quo and problems of China's electronic manufacturing industry.
Mr. Xue's expertise and experience is the application and management of SMT and ESD technologies. In terms of knowledge and experience, Mr. Xue's specialty is that he can cooperate well with management, engineering skills and technical applications, as well as technical integration and coordination in various technologies. This includes technology, equipment, quality, design, measurement and so on. This makes him more comprehensive, effective and thorough than ordinary consultants in the industry. In addition, Mr. Xue also has strong engineering technical support, such as metrology, data analysis and application ability, DOE and so on. Make him have good practical innovation and strong fault or problem analysis ability. We can see many unique practices in what he provides to users. In this lecture, you will also have the opportunity to learn about.