Sputtering targets are mainly used in electronic and information industries, such as integrated circuits, information storage, liquid crystal displays, laser memories, electronic control devices and so on. It can also be used in glass coating, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative products and other industries.
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Precautions:
It is very important to keep the vacuum chamber clean, especially the sputtering system. Any residue formed by lubricating oil, dust and pre-coating will accumulate pollutants such as water, which will directly affect the vacuum degree and increase the possibility of film formation failure. Short circuit or target arcing, rough film surface and excessive chemical impurity content are often caused by unclean sputtering chamber, sputtering gun and target.
In order to maintain the composition characteristics of the coating, the sputtering gas (argon or oxygen) must be clean and dry, and air needs to be pumped out after the substrate is loaded into the sputtering chamber to achieve the vacuum degree required by the process.
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