Jiangyin Changdian Advanced Packaging Co., Ltd. was established by Jiangsu Changdian Technology Co., Ltd. and Singapore APS Company in August 2003.
Changdian Advanced is mainly committed to the R&D, manufacturing and sales of wafer bumps and their packaging products such as WLCSP, FCOL, FCOS, TCP/COF and COG, and now it has mass production capacity.
The company has a strong technical development team and a number of domestic and foreign invention patents with independent intellectual property rights. The company will devote itself to the improvement of research skills, the development of high-end IC packaging technology, the expansion of existing product lines and technological capabilities, and maintain a competitive technological leading position.
Jiangyin Xinshun Microelectronics Co., Ltd. specializes in research and development, production, sales and application services of semiconductor discrete device chips. The company has formed a monthly production capacity of 4-5 inches of 654.38+0 million tablets, and all technical indicators have been at the leading level of domestic peers. Relying on foreign advanced equipment, strong management technical team at home and abroad, and strict ISO900 1 quality certification system, the company strives to build the brand "Xinshun", which is widely selected by famous semiconductor manufacturers and well received.
"Full participation, continuous improvement and customer satisfaction" is the quality policy of Xinshun Microelectronics. It pursues endless, tailor-made for customers and takes "low cost, high quality, specialization and high efficiency" as its core competitiveness. In the process of growing up, Xinshun always adheres to the value concept of win-win for enterprises, employees and customers.