1, Kunshan: Fu Xingye Plastics, He Zhong Electromechanical, Jingyin New Precision Components, Yu Yongfeng Paper, Liansheng, Zhenggang, Youde, Huaxing, Tianqi, Ding Jing, Longxin, Xinlong, Yiyang, Yuzhun, Mingzhen, Frontier Automation, Gu Yong Chemical, Heng Chang, Zhan Ying Metal, Concentric Electroplating, etc.
2. Suzhou: Titanium Union, Li Jia, Arnold, Lugang, Samsung, Agricultural Medical Machinery, Jinhong and other enterprises;
3. Shanghai: Berry Electronics, Hechang, Pioneer, Pengze, Forest Pressure Vessel Factory, Nano Coatings, Rijia, Yishengbai, Ji Long, Die Casting Machine Factory, Toffee, Mowei, Sidaquan, Chen Cheng, Zhu San, Toffee, Jingdezhen Industry and Trade, Hyde and other enterprises;
4. Changshu: Tang Ye and other enterprises;
5. Taicang: Hu Hui and other enterprises;
6. Dongguan: Zhenggang, Li Pan, Yinghuayu, Quansheng and other enterprises;
7. Shenzhen: Berry Electronics, Fuxing Plastics, Jintai and other enterprises;
8. Taiwan Province Province: Texaco Cam, Weston and other enterprises.
______________________________________________________________
The main products supplied by Foxconn are:
Parts, raw materials, packaging, electroplating and material processing, mold tools, processing services, etc.
1. Electronic spare parts: electronic connectors, wires and cables, precision electronic components, electronic components, computer motherboards and related parts, computer parts, printed circuit boards, automobile parts, etc.
2. Mechanical spare parts: precision springs, precision stamping parts, connecting pins, long shafts, standard parts, German standard parts, square parts, round parts, pins, turning parts, sheet metal parts, cutting parts, shafts, bearings, cams, gears, guide posts, tungsten carbide stamping parts, tungsten carbide products, computer case stamping parts, KGN pneumatic components, SMC pneumatic components and THK-line guide rails.
3. Material: alloy material (such as copper strip, copper bar, steel plate, aluminum plate, etc.). ), photovoltaic materials (such as monocrystalline silicon, polycrystalline silicon wafer, etc. ), semiconductor materials (such as LED, PCB, etc. ), insulating materials (such as plastic particles, plastic films), magnetic materials (such as silicon steel sheets, silicon steel sheets, etc. ) and welding materials (such as welding wire and covered electrode). ).
4. Material processing: spot welding, Teflon, anodizing, electroplating supplies, zinc plating, black zinc plating, bright branding, titanium plating, gold plating, silver plating, electrolytic polishing, heat treatment, surface treatment, desalination, flower biting, Japanese flower biting, S45C tempering, etc.
5. Packaging materials and products: waterproof and dot-proof materials (such as PS, PE plastic plates, PE bags, PVC blister packaging of various specifications, wrapping paper, corrugated boxes, cardboard, etc. ), cushioning materials (such as foam, sponge, etc. ), printed matter (such as color boxes, labels, etc.). ), non-metallic small pieces (such as conductive cloth, conductive foam, etc. );
6. Processing and auxiliary equipment: tool cabinets, profile racks, templates, die sets, etc.
————————————————————————————
With Microsoft, Fuji, Dell, Hewlett-Packard, Sony, Nokia, Motorola, Samsung, Apple, Cisco, IBM, NEC, Siemens, Alcatel, Epson, Xerox and other world-class 3C leading manufacturers to form a long-term strategic alliance.