In terms of packaging products, from 1995 to 1996, low-density volatile and nonvolatile memories are mainly developed, which belong to large-volume colloid packaging. Such as DIP, dip, SOJ, PLCC, SOP330, 450 Mils, LQFP, TSOP (Ⅱ) 300 and other products.
From 1997 to 1998, the products are shorter, lighter and denser, and the proportion of logical products has been successfully increased, such as SOP 150/300 mil, TSOP (II) 300, 400 mil and other products.
1999 from 2000 to 2000, CSP products based on TF-BGA, mini-BGA and QFN were launched one after another and successfully put into mass production. And committed to the trend of high pin count, high density, good heat dissipation and electrical performance.
In 200 1 year, flip-chip and bare-chip products were successfully mass-produced, and developed into system-integrated IC and modular products, such as MCP packaging and RF high-frequency IC modules.
In the future, it will continue to develop into high-density, high heat dissipation, multi-pin and miniaturized products. And is committed to unified wafer-level packaging testing, such as COF and WLP products.
The test factory also provides customers with unified test services from CP to FT. We have the most sophisticated, high-resolution and high-efficiency testing machines and equipment on the market to provide customers with the most reliable and perfect service.