What is the long-term technology for?

Changdian Technology is an integrated circuit manufacturing and technical service provider. The company's main business includes system integration, design simulation, technology development and other testing of integrated circuits, and can provide direct transportation services for semiconductor customers all over the world. The products, services and technologies of Changdian Technology cover mainstream integrated circuit system applications, including network communication, mobile terminals, high-performance computing, vehicle electronics and other fields. Based on the large-scale production of traditional IC packaging, the company is committed to the research and development of high-end packaging technology, and has taken the lead in realizing the large-scale production of WL-CSP, SiP, copper pillar bump, flip chip and other technologies in China. Among them, 25um ultra-thin chip manufacturing technology, 25um ultra-thin chip stacking technology, high-density gold wire/copper wire bonding technology, micro-integrated system substrate technology (MIS) and high-density copper post bump technology have reached the international advanced level, and have a number of independent intellectual property rights. In the future, the company will continue to seek greater breakthroughs in the fields of high density, system integration and micro-volume packaging technology.