What is the sinking process of gold?

Gold deposition process is one of the deposition methods of electroless nickel and gold plating, which uses chemical oxidation-reduction reaction to generate coating, and can reach a thicker gold layer. The gold deposition process deposits a nickel-gold coating with stable color, good brightness, flat coating and good solderability on the surface of printed circuit. It can be basically divided into four stages: pretreatment (degreasing, micro-etching, activation and post-leaching), nickel precipitation, gold precipitation and post-treatment (waste gold washing, DI washing and drying). The thickness of the gold deposit is 0.025-0. 1 micron. Gold should be used for surface treatment of circuit boards, because gold has strong conductivity, good oxidation resistance and long service life, and is generally used in key boards, gold finger boards and so on. /QA/2020/06/25/2 11593092802166562 extended data main flow1. The equipment used for nickel-gold pretreatment is mainly grinding machine or sandblasting machine or * * * model. (Many models are used) Its main function is to remove. 2. The production line of electroless nickel plating and gold plating adopts vertical production line, and the main technological processes are as follows: plate feeding → degreasing → tertiary washing → pickling → secondary washing → micro-etching → secondary washing → prepreg → activation → secondary washing → electroless nickel plating → secondary washing → chemical gold → gold recovery → secondary washing → plate discharging (recommended DZ-80X product of Guangdong Dazhi Environmental Protection Technology Co., Ltd.) 3.