A brief history of Nantong Fujitsu microelectronics co., ltd.

The company was established in June of 1997+00, with more than 5,500 employees. As a national high-tech enterprise, the vice-chairman unit of China Semiconductor Industry Association and the executive vice-chairman unit of China Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Alliance of the Ministry of Science and Technology, Nantong Fujitsu has always stood at the forefront of the industry's scientific and technological development and insisted on promoting development through science and technology. The company has a national postdoctoral workstation, a provincial technical center and an engineering technology research center, and has taken the lead in passing three international management system certifications: ISO900 1, ISO 1400 1 and ISO/TS 16949. Over the years, the company has undertaken and completed a number of national and provincial technical transformation projects, which has effectively promoted the industrialization of advanced packaging and testing technology in China. In 2009, the company undertook and implemented two national key scientific and technological projects, namely "Development and Industrialization of Advanced Packaging Technology" and "Application Project of Key Packaging Test Equipment and Materials". Since the implementation of the special project, it has achieved fruitful technological innovation results, and the products and technologies such as WLCSP, BGA, BUMP and highly reliable automotive electronics successfully developed are leading in China.

The company has strong overseas market development ability and competitiveness, with exports accounting for 70%. The main customers are world-renowned semiconductor companies, and more than half of the top 20 semiconductor companies in the world, such as Motorola, Siemens and Toshiba, are customers of Nantong Fujitsu.

Nantong Fujitsu Microelectronics Co., Ltd. is a Chinese-foreign joint-stock enterprise jointly invested by Nantong Huada Microelectronics Co., Ltd. and Fujitsu (China) Co., Ltd., with a registered capital of145.85 million yuan. At present, the company is the backbone enterprise with the largest scale, the highest technical level and the largest variety of products in China, specializing in providing one-stop service (back-end turnkey) from chip testing (PT) to packaging (assembly) to final testing.

The company has a technical center, backed by Fujitsu, one of the top 100 companies in the world, and adopts JEDEC international standards to continuously develop post-packaging testing technologies and processes that keep up with the trend of IC chip design and manufacturing. The company has a series of package shapes such as DIP, SOP, SOT, SIP, QFP, BCC, LCC, TO and PGA. , and has high-end IC packaging technologies such as MCM(MCP) and MEMS. Every year, the company independently develops hundreds of kinds of testing software, which are applied to IC testing in flash memory, automotive electronics, computer peripherals, RF devices and other fields. The company's lead-free electroplating processes such as palladium plating, pure tin, tin and bismuth plating, chip thinning and dicing below 8 inches and 150 micron and computer-aided multi-head testing technology have reached the international leading level. The company actively cooperates with major wafer manufacturers at home and abroad to develop the packaging technology of 12 inch chips.

The company implements technical transformation every year, and has invested hundreds of millions of yuan to undertake and complete a number of national and provincial technical transformation projects, so that the production capacity continues to expand to meet market demand.