Huatian Science and Technology insists on development as the theme, technological innovation as the driving force, product structure adjustment as the main line, and advocates management innovation, product innovation and service innovation. While expanding and upgrading the scale and level of the existing integrated circuit packaging business, we will vigorously develop high-end packaging technologies and products such as BGA, MCM(MCP), SiP, FC, TSV, MEMS, Bumping, Fan-Out and WLP, and expand the company's business field.
Extended data
Huatian technology generally refers to Tianshui Huatian technology co., ltd.
Tianshui Huatian Technology Co., Ltd. is a company listed on Shenzhen Stock Exchange. It was established on February 25th, 2003 and listed on Shenzhen Stock Exchange on October 20th, 2007.
The company is mainly engaged in packaging and testing of semiconductor integrated circuits, MEMS sensors and semiconductor components.
1October 28th, 2020, 165438+ China Enterprise Evaluation Association released the top 500 new economic enterprises in China in 2020, and Tianshui Huatian Technology Co., Ltd. ranked 398th.
Since its establishment, the company has effectively improved its technological innovation ability, equipment level and market share by deepening enterprise reform, strengthening scientific and technological innovation, strengthening internal management, vigorously exploring the market and implementing technological transformation. The annual packaging capacity and actual processing capacity of integrated circuits have increased rapidly year after year, and the comprehensive competitiveness and economic benefits of enterprises have been greatly improved. In 2005, there were 654.38+23.9 million IC packages, with sales revenue of 3654.38+65438 yuan and profit of 3865438+20,000 yuan, up by 46% and 58% respectively.