The power consumption of 5G mobile phones has doubled, and the volume and price of the cooling module industry have risen. According to media reports in Taiwan Province Province, the power consumption of 5G mobile phones is more than twice that of 4G mobile phones, and the demand for cooling modules has also exploded. The share prices of major manufacturers of cooling modules such as Shuanghong, Zhong Chao and Jiance have risen one after another, and Shuanghong has increased by nearly 1 10% since last year.
Since its establishment, Shenzhen Danbang Technology Co., Ltd. (hereinafter referred to as Danbang Technology) has been focusing on the research, development, production and sales of FPC, COF flexible packaging substrates and COF products, providing customers with comprehensive flexible interconnection solutions and chip packaging solutions based on flexible substrate technology in the microelectronics field.