1986 has established an automatic production line for discrete devices.
1989 built an integrated circuit automation production line.
1995 cooperated with Philips to open an IC processing factory.
In 2000, it was restructured into a joint-stock company with a registered capital of127.87 million yuan.
200 1, discrete device manufacturing company and integrated circuit manufacturing company were established;
"Southeast University, Postgraduate Class of Changdian Science and Technology" started;
"Tsinghua University and Changdian Technology Packaging Technology Research Center" was established. In 2003, Changdian Technology was successfully listed on the Shanghai Stock Exchange.
ERP system put into use;
Established "Jiangyin Changdian Advanced Packaging Co., Ltd." with Singapore APS.
In 2004, Beijing Changdian Zhiyuan Optoelectronics Co., Ltd. was established in cooperation with Beijing University of Technology.
In 2005, Jiangsu Xinzhi Optoelectronic Integration Co., Ltd. was established in cooperation with Southeast University.
Invented 2 1 patented technologies such as FBP (planar bump package).
In 2006, it passed TS 16949 certification and implemented QC080000 system. In 2007, Changdian Technology New City East Factory was officially put into use.