Manufacturing technology of Lianhua electronics co., ltd.

From 65438 to 0998, UMC exceeded the global average set by the International Semiconductor Technology Roadmap (ITRS), and now it has kept pace with the world's top semiconductor companies in the research and development of new technology. In 2003, UMC became the first pure wafer manufacturing company to successfully produce customers' products using 90 nm process technology.

High-tech application products are very different in terms of their respective technologies. UMC provides appropriate process technology and process component options, including ultra-high-speed components and ultra-high-density components, to meet the needs of customers in any product application.

UMC provides integrated logic and mixed-signal technology that spans the special process from 90 nm to 0.6 micron. Customers can choose different process nodes, voltage options and mixed signal /RF complementary metal oxide semiconductor technology to form a customized platform foundation that meets the requirements of a single system and a single chip.