7070 SMD LED is the first attempt to define its own LED package size in China, and Shenzhen Haotian Optoelectronics Co., Ltd. is the initiator. In the situation that the whole LED packaging industry blindly follows the trend and lacks independent innovation, Haotian threw the killer to define its own LED packaging size to the industry. Up to now, 7070 SMD LED has obtained patent certificates from China, Japanese, German, Hongkong and other countries, which is an independent innovation of domestic LED packaging industry.
7070 SMD LED global patent certificate
Because of its small size, 7070 SMD LED can meet the heat dissipation requirements of 1W, so it has the advantages of high power and SMD LED. On the one hand, the rated power of 1W is higher than that of traditional small patches. On the other hand, compared with the traditional lumen-imitating high-power LED, it can realize full-automatic production, and its production capacity is four times that of lumen-imitating high-power LED, so it can realize automatic welding. The application of automatic mounter can greatly improve the efficiency of product application.
See the following table for the parameters of 7070 SMD led:
The 7070 SMD LED has the American Energy Star LM-80 certification and the European Union ROHS, REACH, EN6247 1 certification.
American LED-80 authoritative certification, EU safety testing certification.
The size and photoelectric parameters of 7070 determine that it is the preferred light source for LED home lighting products in the future, so it is often used in LED ceiling lamps, LED downlights, LED bulb lamps and other furniture lighting products.
Product advantage
1 and 7070 SMD LED adopt special heat dissipation design, which shortens the heat conduction channel, enables the heat of the chip to be instantly led out, and effectively prolongs the service life of the product. The thermal conductivity of this product is 5 times that of imitation lumen.
2. The power of the patch is as high as 1W, with high luminous efficiency, uniform light spots and good luminous consistency.
3. Imported chips are adopted, and the thermoelectric is separated and conducted, so the quality is more stable.
4. All products are encapsulated by fluorescent colloid with high light transmittance, which meets the requirements of environmentally-friendly lead-free process products.
5. Ultra-thin package size design is beneficial to the automatic production of products and automatic patch welding in the later stage of products.
6, surface emitting LED, high light efficiency, low power consumption, low calorific value.