1, advanced technology, Suzhou Keyang, a Dagang stock holding company, is one of the few companies that master wafer-level chip packaging technology. The company has advanced packaging technology and large-scale production capacity. RDL packaging method is adopted, which makes the ratio of chip area to packaging area 0.7, which is the best packaging method.
2. In terms of pin design, the pin used in the chip package is short, which can reduce the signal delay, and the package is thin, which is convenient for heat dissipation.