The main business of Changdian Technology includes:
1. semiconductor packaging: changdian technology provides various semiconductor packaging solutions, such as ball grid array package (BGA), chip-level package (CSP) and wafer-level package (WLP). These packaging technologies are helpful to improve the performance, integration and reliability of semiconductor chips.
2. Semiconductor testing: Changdian Technology has advanced testing equipment to provide customers with full-process services from chip design verification to production testing. This includes functional testing, performance testing and reliability testing.
3. Semiconductor manufacturing: Changdian Technology is also involved in the field of semiconductor manufacturing, providing OEM production services for various semiconductor products.
Changdian Technology has several production bases around the world, and has maintained long-term cooperative relations with many internationally renowned semiconductor manufacturers. Through continuous technological innovation and capacity expansion, Changdian Technology has become a leading enterprise in the domestic semiconductor packaging and testing industry.