1, changdian technology, the company supports and participates in the formulation process of global small chip interconnection standards.
2. Crystal technology, Chiplet technology is one of the development trends in the industry at present, which is a synthesis of many complex advanced packaging technologies and standards, rather than a single technology.
3. Tongfu microelectronics and advanced packaging technology are important development trends in the future.
4, Huatian Technology, master Chiplet related technologies.