Professional packaging design company/Shanghai Mike Semiconductor Technology Co., Ltd.
Mike is a research institute specializing in package design, package simulation and package signal integrity analysis.
The company advocates the collaborative design concept of integrated circuit design, packaging design and PCB design, participates in the process of chip design and PCB design, and provides the most competitive packaging solution for chips. Mike has a standardized packaging design process and organizational structure, and strictly analyzes packaging cost, packaging design and packaging electrothermal stress simulation to provide customers with the best service. Mike has accumulated world-class packaging design technology and simulation analysis technology, and has rich experience in collaborative design of IC design. SI design service team: dedicated to providing signal integrity solutions from the chip IO-package-PCB system, optimizing the implementation of signal integrity design in the IC development stage, and providing SI system solutions in the chip application stage. Packaging design service team
Committed to becoming a leading IC packaging design service center, providing semiconductor packaging development platform, packaging sample processing and quality control.
Company services:
1. signal integrity analysis
2. Packaging selection and packaging production arrangement
3. Assembly design
4. Electrical simulation of package
5. Thermal/stress simulation of package
6. packet signal integrity analysis
SI analysis:
-IO buffer selection and simulation analysis;
-IO buffer selection
-Matching control
-Routing constraints
-Provide simulation parameters required by STA.
-Pad orders and; Pin mapping design:
-Interface direction
-Calculation and distribution of power supply quantity.
-Same interface signal grouping.
-Control of signal jitter, skew, influence and other electrical parameters.
-Location of key signal
-Signal integrity analysis of key interfaces;
-SSN simulation analysis
-Power supply, noise analysis
-Noise simulation analysis
-Crosstalk analysis
-Analog analysis of key signals
-Interface design guide
-package electrical simulation:
-Extract the local or global encapsulation model of the critical interface.
-provide spice model and IBIS model of the whole chip.
-Provide a complete package design solution for chips;
-pinmap design
-PAD order design
-Packaging selection
-Packaging structure design
-package substrate design
-Design of packaging mould
-Consult the BOM of various environmental protection requirements for packaging.
-Guide to packaging process parameters
-package simulation:
-package electrical simulation
-package thermal and stress simulation
-Packaging production
Contact information: Leonard _ Peng @126.com.