The Development Course of Hangzhou Shi Lan Microelectronics Co., Ltd.

1September 1997: Hangzhou Shi Lan electronics co., ltd was established.

1997 10 month: acquisition of 40% equity of Hangzhou Wang You electronics co., ltd.

199965438+February: it was recognized as a high-tech enterprise in Zhejiang province.

June 5438 +20001October: Shenzhen Deep Blue Microelectronics Co., Ltd. was established (responsible for the sales business in South China of China).

June 5438 +2000 10: The whole company was restructured into Hangzhou Shi Lan Microelectronics Co., Ltd.

200 1 1: Hangzhou lance integrated circuit co., ltd (a wholly-owned subsidiary of silicon wafer manufacturing) was established.

March 2002: It was recognized as one of the first integrated circuit design enterprises by China Semiconductor Industry Association.

July 2002: It was recognized by the Ministry of Science and Technology as the backbone enterprise of the software industry base of the National Torch Program.

March 2003: 26 million A shares were listed on the Shanghai Stock Exchange.

June, 2003165438+1October: The chip testing factory in Hangzhou (Binjiang) High-tech Development Zone started construction.

September 2004: Hangzhou Lansing Mingxin Technology Co., Ltd. (a wholly-owned subsidiary of LED chip manufacturing) was established.

July 2005: The American R&D Center of Silane Microelectronics (located in Silicon Valley, California) was established.

September 2006: Silane Microelectronics Shanghai R&D Center was established.

065438+2007 10: The first high-efficiency power LED driver circuit manufactured by Ceylon integrated BCD process was released.

April 2007: The first single-chip DVD player chip is released.

July 2009: Hangzhou Meikale Photoelectric Co., Ltd. was established and entered the LED packaging business.

August, 2009: Korea Office was established in Seoul.

20 10: Taiwan Province provincial office is established in Taibei.

20 10 September: 30 million shares will be issued.

2010165438+10: Chengdu Shi Lan semiconductor manufacturing co., ltd successfully laid the foundation stone in Chengdu-ABA industrial park.

20 10 12: enter the power module packaging business.