One of the development directions: miniaturization
As the core equipment of optical fiber access network, optical transceiver module promotes the development of trunk optical transmission system to low cost and makes the configuration of optical network more perfect and reasonable. The optical transceiver module consists of photoelectric devices, functional circuits, optical interfaces and other structural components. The photoelectric device includes a transmitting part and a receiving part, and the transmitting part includes light sources such as LED, VCSEL, FP LD and DFB LD. The receiving part includes two kinds of photodetectors: PIN and APD.
At present, the competition in the optical communication market is becoming more and more fierce, the volume of communication equipment is getting smaller and smaller, and the interface density contained in the interface board is getting higher and higher. The traditional optical module with laser and detector separated has been difficult to meet the requirements of modern communication equipment. In order to meet the requirements of communication equipment for optical devices, optical modules are developing into highly integrated small packages. Highly integrated photoelectric module makes it unnecessary for users to process high-speed analog photoelectric signals, shortens R&D and production cycle, reduces the types of purchased components and reduces production costs, so it is increasingly favored by equipment manufacturers.
At present, the packaging of optoelectronic devices in optical transceiver modules has developed from large-scale dual in-line packaging to coaxial packaging. Optical interface and other structural components have developed from ST and FC to SC and smaller LC and MT-RJ connectors, and the corresponding packaging form of optical transceiver module has also developed from metal packaging to plastic packaging, from single-interface separation module to dual-interface transceiver module. Pin arrangement and packaging have developed from 20-pin and 16-pin separation module to single-row 9-pin (1X9), double-row 9-pin (2X9) and future double-row 10-pin and double-row 20-pin transceiver modules. SFF(Small Form Factor) small package optical module adopts advanced precision optics and circuit integration technology, and its size is only half that of ordinary duplex SC( 1X9) optical transceiver module, which can double the number of optical ports in the same space, increase the density of line ports and reduce the system cost of each port. Moreover, SFF small package module adopts MT-RJ interface similar to copper wire network, and the size is the same as that of ordinary computer network copper wire interface, which is beneficial to the transition of existing network equipment mainly based on copper cable to higher-speed optical fiber network and meets the rapidly growing network bandwidth demand.
With the advantage of small package size, the small package optical transceiver module doubles the number of optical fiber interfaces of network equipment, and the single-port rate reaches gigabit level, which can meet the rapidly growing network bandwidth demand in the Internet era. It can be said that the small package optical transceiver module technology represents the development trend of the new generation of optical communication devices and is the cornerstone of the next generation of high-speed networks.
Major overseas optical module suppliers have produced various small packaged optical modules with different speeds and distances, and some domestic optical device suppliers (like Shanghai Daya Optoelectronics) have also begun to develop and produce SFF small packaged optical modules with different speeds.
The second development direction: low cost and low power consumption.
The volume of communication equipment is getting smaller and smaller, and the interface density contained in the interface board is getting higher and higher, which requires the development of photoelectric devices in the direction of low cost and low power consumption.
At present, optical devices generally adopt mixed integration process and airtight packaging process, and the next development will be non-airtight packaging, which needs to rely on passive optical coupling (non-X-Y-Z direction adjustment) and other technologies to further improve the degree of automatic production and reduce costs. With the rapid growth of the market demand for optical transceiver modules, the suppliers of ASIC for some functional circuits are gradually increasing. The supplier's active investment in scale and serialization makes the performance of this kind of IC more and more perfect and the cost lower and lower, thus shortening the development cycle of optical transceiver module and reducing the cost. In particular, GaAs technology and technology are used for high speed, small signal and high gain preamplifier. With the development of SiGe technology, the yield and manufacturing cost of this kind of chips are well controlled, and the power consumption can be further reduced. In addition, the use of uncooled lasers further reduces the manufacturing cost of optical modules. At present, all small package optical modules are powered by low voltage 3.3v, which ensures that the increase of ports will not increase the power consumption of the system.
The third development direction: high speed
People demand more and more information and faster information transmission rate. As the main pillar of modern information exchange, processing and transmission, optical communication network has been developing towards ultra-high frequency, ultra-high speed and ultra-large capacity. The higher the transmission rate and capacity, the lower the cost of transmitting each information. At present, 10 Gbit/s and 40Gbit/s are hot spots with long distance and large capacity. According to the latest market research of ElectroniCast, the global total consumption of 10 Gbit/s data communication transceiver module will increase from 200 110.57 billion dollars to 219 billion dollars. In the early days of 200 1, the number of 10 Gbit/s data communication transceiver modules was less than 654.38+million, but by 2003, the number of 10 Gbit/s data communication transceiver modules will increase to 2 million. In the next few years, it will continue to grow rapidly, reaching 7 million units in 2005. In the whole consumption field, after 10 Gigabit Fibre Channel, 10 Gigabit Ethernet will have a strong impact.
At present, SDH single-channel optical system is impacting 40Gbit/s. In terms of high-speed systems and devices, many companies have launched 40Gbit/s systems this year. At present, the key product technologies of 40Gbit/s are: high-power wavelength tunable/fixed laser, 40Gbit modulator (Inp EAM, LiNbO3EOM, polymer EOM), high-speed circuit (Inp, GeSi materials), wavelength locker, low-dispersion filter, dynamic equalizer, Raman amplifier, low-dispersion switch, 40Gbit/sPD(PIN, APD), and adjustable dispersion compensator module (APD).
Judging from the current circuit technology, 40Gbit/s is close to the limit of "electronic bottleneck". No matter how high the speed is, it is difficult to solve the problems of signal loss, power consumption, electromagnetic radiation (interference), impedance matching, etc., even if it is solved, it will cost a lot of money.
The fourth development direction: long distance
Another development direction of optical transceiver module is long distance. Nowadays, the optical network is laid farther and farther, and the remote transceiver is needed to match it. A typical remote transceiver signal can transmit at least 100 km without amplification, mainly to save expensive optical amplifiers and reduce the cost of optical communication. Considering the transmission distance, many remote transceivers choose 1550 band (wavelength range is about 1530 ~ 1565nm) as the working band, because the light wave loss is the smallest when transmitting in this band, and all available optical amplifiers work in this band.
The fifth development direction: hot plug
The future optical module must support hot plug, that is, the module can be connected or disconnected with the equipment without cutting off the power supply. Because the optical module is hot-swappable, the network administrator can upgrade and expand the system without shutting down the network, which will not affect online users. Hot plugging also simplifies overall maintenance and enables end users to better manage their transceiver modules. At the same time, due to this heat exchange performance, the module enables network managers to plan the transceiver cost, link distance and all network topologies as a whole according to the requirements of network upgrade without replacing all system boards. At present, there are GBIC and SFP (small pluggable) optical modules to support this hot plug. Because SFP and SFF are similar in size, they can be directly inserted on the circuit board, which saves packaging space and time and is widely used. Therefore, its future development is worth looking forward to, and may even threaten the SFF market.
Let me talk about their types:
1X9 single-mode optical transceiver module product performance;
1X9 package single-mode module
Single power supply +3.3V or +5V.
LVPECL/PECL/TTL data interface, DC coupling.
Meet the requirements of ITU-TG957/958 specification.
1 products meet the requirements of IEC 60825- 1
Meet the requirements of GR-468-CORE.
Can supply lead-free products.
>1x9 multimode optical transceiver integrated module
850 nm VCSEL or 13 10 nm FP-LD
1X9 package multimode module, double SC/ST optical interface.
Single power supply +3.3V or +5V.
LVPECL/PECL data interface, DC coupling
It fully meets the requirements of ITU-TG957/958 specification.
Meet the requirements of Telcordia(Bellcore)GR-468-CORE.
Low cost and low power consumption
Can provide products that meet the requirements of RoHS specification.
& gtGBIC optical transceiver integrated module
Single power supply +3.3V or +5V power supply, dual SC interface with hot plug function.
850 nm/13 10 nm/1550 nm VCSEL/FP/DFB, single mode or multimode.
Based on Gigabit Ethernet 1000 Foundation -SX/LX/XD/ZX
Class 1 products meet the requirements of IEC60825- 1.
Meet the requirements of Telcordia (Bellcore) GR-468-CORE.
Meet the requirements of IEEE-802.3 and ANSI specifications.
Meet the requirements of gigabit interface conversion specification Rev.5.5( 1).
Can supply lead-free products.
& gtSFF optical transceiver integrated module
2X5 small SFF package
Dual LC optical interface, single mode or multimode module
Single power supply +3.3V power supply, low-voltage PECL data interface.
Class 1 products meet the requirements of IEC60825- 1.
Working temperature: -40℃~ +85℃
Meet MSA requirements
Meet the requirements of Telcordia (Bellcore) GR-468-CORE.
Can supply lead-free products.
& gt SFP optical transceiver with hot plug function and dual LC optical interfaces.
Single power supply +3.3V power supply, low-voltage PECL data interface.
Class 1 products meet the requirements of IEC60825- 1.
Working temperature: -40℃~ +85℃
Meet the requirements of Telcordia (Bellcore) GR-468-CORE.
Can supply lead-free products.
Volume module
Agilent, Shenzhen Ouningbei and Hublot all do this.