UNISEM(www.unisem.com.my) was founded in 1989, the second largest semiconductor packaging and testing company in Malaysia, and began to engage in independent IC packaging and testing in 1992. At present, Unisem provides customers with wafer testing, IC packaging testing and related auxiliary services. With the world-leading semiconductor packaging and testing technology, it is headquartered in Ipoh, Perak, Malaysia, and has production bases in Malaysia, Britain, China and other countries. About 94% of its products are sold to Europe and America and 6% to Asia. In August, 2004, Unison announced an investment of US$ 2,654,380,000 to build Unison's most modern semiconductor factory in the west of export processing zone in Chengdu High-tech West Zone, making it the flagship enterprise of Unison in the world-Yuxin (Chengdu) Integrated Circuit Packaging and Testing Co., Ltd. The new factory will adopt the most advanced brand-new equipment in the world to produce high-end products such as SLP, BGA, SOIC and TSSOP. At the end of 2004, Yuxin Chengdu factory started construction and is expected to be put into production in mid-2006. After the completion of the Yuxin (Chengdu) project, the total number of employees will reach 4,500-5,600. Yuxin Chengdu takes team spirit, trust, responsibility, initiative and care as its core values, and attaches great importance to employee welfare, health and safety. We regard employees as the most valuable assets of the enterprise and provide good training for employees, including overseas training and broad development space. Sincerely invite you to join us, create with us, witness the growth of Yuxin and share the joy of success. Please fax, mail or email your resume in Chinese and English with your recent photo to the Human Resources Department of Yuxin (Chengdu) Integrated Circuit Packaging and Testing Co., Ltd., No.8 Kexin Road, Xiyuan, Chengdu High-tech Zone. Postal code: 6 1 173 1 fax: 028-87958 166 E-mail :staffing@unisem-chengdu.com.cn Website: www.unisem.com.my.
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